The South Korean manufacturer, already well known in the storage industry, showed its first SSD solution of BGA chips to Samsung SSD Forum Japan. BGA stands for Ball Grid Array, a technology is not entirely new in the field but less used the PGA counterpart. Where the latter uses the pin for interconnection to the logic board, the BGA standard makes use of small pad soldered with tin balls. There are of course pros and cons with similar technology.
Unlike the pin, which can only cover the perimeter of the chip for interconnection to the logic board, the welds in a BGA chip can occupy the entire surface, considerably increasing the density of connections that can have the single chip. As part of the memory cards this results in increased storage capacity per chip. A chip BGA is however permanently soldered to the logic board and can not be removed with ease.
SSDs BGA can be smaller than the M.2 counterparts for the same capacity, with the technology that has been repeatedly told in enthusiastically by Intel. The chip shown by Samsung at the event was smaller than a microSD, and specifications described by Samsung - not many to be honest - they do hope for positive: Samsung PM971 uses MLC NAND-V modules with 2-bit capable of reading sequential order of 1.500MB / s and 600MB / s write.
As for the random access, the numbers reported by the company are of 190,000 IOPS and 150,000 IOPS in reading and writing, respectively. The chip will be integrated on tablets and PC 2-in-1, according to revealed by the company, starting from the second half of 2016 or at the latest in early 2017.
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