A clock frequency of 4.266 MHz certified by the producer: this is the result which came with new memories G.Skill Trident Z family DDR4 standard.
This kit is composed of two modules of 8 Gbytes of capacity each, certified to operate with CAS latency 19 to 4,266 MHz. They are part of this family also have two other kits designed to be used on more limited frequencies but with timings far more driven: the first it operates at a clock frequency of 3200 MHz with CL13 while the second clock of 3,466 MHz with latency equal to CL14.
The chips used are Samsung 8 Gbit each, while the cooling system is matched to that of the other modules of the family Trident Z: a massive plate, which is spread more of the memories of PCBs in height, with a marginal graphical characterization.
The memories from 4,266 MHz are only available in dual channel kits from 8 Gbytes of capacity per module; versions to 3.200 MHz and 3.466 MHz clock are also sold in configuration to 4 modules, the variable capacity of 8 to 16 Gbytes per module. The memories are of course compatible with Intel-based platforms Z170 chipset, combined with the XMP 2.0 technology; the supply voltage is equal to 1.35V, an upper 0,15V value than that of JEDEC for DDR4 modules.
This kit is composed of two modules of 8 Gbytes of capacity each, certified to operate with CAS latency 19 to 4,266 MHz. They are part of this family also have two other kits designed to be used on more limited frequencies but with timings far more driven: the first it operates at a clock frequency of 3200 MHz with CL13 while the second clock of 3,466 MHz with latency equal to CL14.
The chips used are Samsung 8 Gbit each, while the cooling system is matched to that of the other modules of the family Trident Z: a massive plate, which is spread more of the memories of PCBs in height, with a marginal graphical characterization.
The memories from 4,266 MHz are only available in dual channel kits from 8 Gbytes of capacity per module; versions to 3.200 MHz and 3.466 MHz clock are also sold in configuration to 4 modules, the variable capacity of 8 to 16 Gbytes per module. The memories are of course compatible with Intel-based platforms Z170 chipset, combined with the XMP 2.0 technology; the supply voltage is equal to 1.35V, an upper 0,15V value than that of JEDEC for DDR4 modules.
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