Two widespread reports from different sources are in agreement now already in full swing during the production of the new iPhone. First, Digitimes confirms that Apple's partners will begin to deliver the new iPhone 7 and iPhone 7 Plus from the end of the third quarter of 2016, a date consistent with the hypothesis repeatedly emphasized the marketing of new Melafonino in autumn.
Specifically, Foxconn Electronics and Pegatron Technology will take care of the production of iPhone 7 with 4.7 "display, while Winstron, along with Foxconn, will concentrate its efforts on Plus variant, or one with 5.5" display. Apple would choose to distribute orders among multiple suppliers to reduce risks related to production and should count at the time, on the support of no less than two suppliers for critical components such as batteries and casing. Among Apple suppliers Intel is also found that, according to the source, will provide 50% of the modem chip for the new iPhone.
The information from Digitimes are an indirect confirmation in a second report, the Economic Daily News, the content of which was recently released by CNBC. The second source refers to the activation of a new wave of hiring by Foxconn and Pegatron; the staff will be employed in the assembly of the new iPhone, it reports the EDN includes additional details about the startup timing of the new round of recruitment. An early start at least one month compared to the usual road-map production of the new iPhone, followed by Apple's partner companies.
The reason is linked, according to the EDN, the new constructive solutions introduced by Apple with the iPhone 7 and iPhone 7 Plus, the design of which is described as more complex than that of previous models. This circumstance activity of staff training would require assembly worker longer than in the past, making it appropriate, therefore, early recruitment to meet the delivery time.
Recent rumors have described the iPhone 7 and iPhone 7 Plus not too different in terms of design from the previous iPhone 6 / 6S and 6 Plus / 6 6 Plus. Then conflicting information, unless the reference to differences in design than previous models does not cover changes intervened in the internal components and not the external appearance of the terminals. Among the possible hardware changes include the integration of the soc A10, 3GB of RAM and the aforementioned Intel modem chip.
New reports suggest, however, that the market approach procedure of the new iPhone goes second when previously assumed. Some basic changes in the integration Melafonino future software could be presented at the WWDC set for next month (13-17 June) and during which Apple probably will raise the curtain on iOS 10. For the official launch of Phone 7 and iPhone 7 Plus, however, will need to wait until the autumn.
Specifically, Foxconn Electronics and Pegatron Technology will take care of the production of iPhone 7 with 4.7 "display, while Winstron, along with Foxconn, will concentrate its efforts on Plus variant, or one with 5.5" display. Apple would choose to distribute orders among multiple suppliers to reduce risks related to production and should count at the time, on the support of no less than two suppliers for critical components such as batteries and casing. Among Apple suppliers Intel is also found that, according to the source, will provide 50% of the modem chip for the new iPhone.
The information from Digitimes are an indirect confirmation in a second report, the Economic Daily News, the content of which was recently released by CNBC. The second source refers to the activation of a new wave of hiring by Foxconn and Pegatron; the staff will be employed in the assembly of the new iPhone, it reports the EDN includes additional details about the startup timing of the new round of recruitment. An early start at least one month compared to the usual road-map production of the new iPhone, followed by Apple's partner companies.
The reason is linked, according to the EDN, the new constructive solutions introduced by Apple with the iPhone 7 and iPhone 7 Plus, the design of which is described as more complex than that of previous models. This circumstance activity of staff training would require assembly worker longer than in the past, making it appropriate, therefore, early recruitment to meet the delivery time.
Recent rumors have described the iPhone 7 and iPhone 7 Plus not too different in terms of design from the previous iPhone 6 / 6S and 6 Plus / 6 6 Plus. Then conflicting information, unless the reference to differences in design than previous models does not cover changes intervened in the internal components and not the external appearance of the terminals. Among the possible hardware changes include the integration of the soc A10, 3GB of RAM and the aforementioned Intel modem chip.
New reports suggest, however, that the market approach procedure of the new iPhone goes second when previously assumed. Some basic changes in the integration Melafonino future software could be presented at the WWDC set for next month (13-17 June) and during which Apple probably will raise the curtain on iOS 10. For the official launch of Phone 7 and iPhone 7 Plus, however, will need to wait until the autumn.
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